Magnetron Sputtering Coating Line

Magnetron Sputtering Coating Line

Details
The vacuum coating production line is a highly specialized manufacturing system, which is mainly used to deposit one or more layers of extremely thin functional films on the surface of substrates (such as glass, plastic, metal, ceramic, semiconductor wafer, etc.). Its core is to vaporize or ionize the coating material through various physical methods in a highly vacuum environment, and then condense it into a film on the surface of the substrate.
Condition: New
Warranty: 1 Year
After-sales Service Provided: Field installation, commissioning and training, Engineers available to service machinery overseas
Certification: CE, ISO9001
Substrate: plastic, PC/PMMA/PET sheet, glass, ceramic, etc.
Vacuum chamber material: SUS-304 superior stainless steel
Vacuum chamber size: Custom-made
Deposition material: Titanium/Aluminum/Chrome/Copper/TiAl/TiN/SS,metal films such as Al, Cr, SUS, Ni, Sn, Ti and alloysetc.
Coating film function: Decorative,super hard, wear-resistant, anti-corrosion, reflective, shielding effect, conduction,non-conduction, etc.
Category
Continuous Coating Line
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Description
Technical Parameters

The Vacuum Coating Production Line is a highly specialized manufacturing system, which is mainly used to deposit one or more layers of extremely thin functional films on the surface of substrates (such as glass, plastic, metal, ceramic, semiconductor wafer, etc.).

 

Its core is to vaporize or ionize the coating material through various physical methods in a highly vacuum environment, and then condense it into a film on the surface of the substrate.

 

Applications:

 

Vacuum coating of copper, silver and other conductive materials on the surface of electrical component ceramics and circuit board ceramics.

 

It is also suitable for vacuum deposition of various metal film layers on the surface of other plate-like workpieces (glass, acrylic board, etc.);

ceramic coating on copper
copper deposition on ceramic
glass vacuum coating

 

Main features:


Magnetic field confines plasma

This is the core feature of magnetron sputtering. By applying a strong magnetic field of a specific shape (usually a ring or racetrack shape) near the target surface, the electrons are confined near the target surface to make spiral motion, which greatly increases the probability of collision and ionization of electrons with working gas (usually argon) atoms.


High ionization rate and high deposition rate

Magnetic field confinement significantly increases plasma density and ionization rate, making the sputtering process more efficient.

This means that at relatively low gas pressure and low sputtering voltage/power, much higher sputtering and deposition rates can be achieved than conventional DC sputtering.

 

Low temperature process

Since most of the energy is used to ionize the gas and sputter target atoms, relatively little heat is transferred to the substrate.

 

Good film quality

Good density, strong adhesion, high purity and good uniformity.

 

Wide range of material adaptability

 

Good process controllability


The magnetron sputtering coating production line has become one of the mainstream technologies for preparing functional thin films (such as optical films, conductive films, wear-resistant hard films, decorative films, anti-corrosion films, magnetic films, semiconductor films, etc.) in modern industry due to its core features and advantages such as high deposition rate, low temperature process, excellent film quality (compact, strong adhesion), wide material adaptability, good uniformity and controllability. It has extremely wide applications in microelectronics, flat panel displays, solar cells, tool coatings, automotive parts, packaging, decoration, optical devices and other fields.

 

 

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