The Vertical Small Magnetron Sputtering Vacuum Coating Line is an advanced equipment that achieves high-quality thin film deposition in a compact space. It is particularly suitable for R&D, small and medium-sized batch production and high value-added products.
Applications:
Deposition of metal films such as nickel and copper on the surface of glass, ceramics and flat products.
Features:
Vertical structure
High space utilization:
The chamber, vacuum system, transmission mechanism, etc. are stacked vertically, and the floor space occupied is much smaller than that of horizontal equipment, which is especially suitable for laboratories or small workshops with limited space.
Less particle contamination
Gravity makes it easier for particles generated during the process to fall to the bottom and less likely to adhere to the substrate surface, which helps to obtain a cleaner film.
Flexible substrate loading:
Usually a hanging basket, tray or rotating substrate rack is used, which makes it easy to achieve simultaneous coating of multiple pieces or uniform coating.
Relatively convenient maintenance:
The main components (such as targets, substrate racks) can usually be maintained from the front or side.
Miniaturization
Low investment cost:
The cost of equipment purchase, installation, and plant renovation (such as clean rooms, electricity, and water cooling) is significantly lower than that of large industrial lines.
Low operating costs:
Fast vacuuming (small chamber volume), low gas consumption and low electricity consumption.
High flexibility:
It is easy to replace the target material, adjust the process parameters, and quickly switch between different coating tasks. It is very suitable for multi-variety, small batch production or R&D trial production.
Easy to integrate and upgrade:
It can be easily integrated into existing experimental lines or small production environments, and it is also easier to expand functions.
Magnetron sputtering technology
High deposition rate:
The magnetic field binds electrons and improves ionization efficiency, resulting in higher sputtering and deposition rates.
Good film quality:
It can produce dense, uniform and highly adhesive films of metals, alloys, oxides, nitrides, carbides, etc.
Good process controllability:
By precisely controlling parameters such as gas pressure, power, gas ratio (reactive sputtering), substrate bias, etc., the composition, structure, thickness and performance of the film can be finely controlled.
Vacuum coating
Pure environment:
It is carried out in a high vacuum environment to avoid atmospheric pollution and ensure the purity and performance of the film.
Widely applicable materials: Almost all solid materials (metals, semiconductors, ceramics, plastics, etc.) can be used as targets or substrates.
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