1. Pre-treatment
- Substrate cleaning: ultrasonic degreasing + plasma cleaning (power 50-200W).
- Clamping and positioning: ensure that the distance between the substrate and the evaporation source is 20-50cm (affecting the uniformity of film thickness).
2. Coating stage
- Pre-sputtering: introduce argon gas (flow rate 10-50sccm) to remove oxides on the surface of the target.
- Main deposition:
- Evaporation coating: rate 0.1-10nm/s (electron beam power 5-20kW).
- Magnetron sputtering: deposition rate 0.01-1μm/min (gas pressure 0.1-1Pa).
3. Post-treatment
- Annealing and strengthening (200-400℃, 1-2 hours) to improve film adhesion (scratch test ≥5N).
