This magnetron sputtering PVD system is designed for thin-film metallization of alumina (Al₂O₃) and aluminum nitride (AlN) ceramic substrates. Specializing in low-temperature, precision thin-film deposition, it is used to prepare seed layers for power electronics, LED, and RF ceramic substrates, this equipment is classified as a system for producing functional electronic thin films.
Equipment Features
Magnetron sputtering-based, multi-source composite architecture, suitable for ceramic substrate metallization
The equipment takes magnetron sputtering as its core and can be used with ion source pre-cleaning. It can integrate multiple targets (Ti, Cr, Cu, Au, Ni, etc.) to achieve multi-layer continuous deposition. The film thickness can be accurately controlled and the film layer has good uniformity.
Low-temperature, ion-assisted process for ceramic substrate protection
Utilizing a low-temperature ion-assisted source, this process prevents thermal deformation, warping, and stress-induced cracking in aluminum nitride (AlN) or alumina (Al₂O₃) ceramic substrates. In-situ plasma cleaning activates the substrate surface, enhancing the adhesion between the metal film and the ceramic base.
Chamber Structure
The vacuum chamber is constructed from 304 stainless steel,horizontal or vertical chamber configurations can be customized based on substrate dimensions.
Vacuum Unit
Molecular pump high-vacuum system,ensures vacuum purity and reduces impurity contamination in the thin film.
Fully Automated PLC Control System
A PLC and touchscreen interface,supports storage of full-process recipes, automatic operation, and process parameter logging,process data traceability, and supports manual, semi-automatic, and fully automatic modes.
Broad substrate compatibility
Compatible with various types of ceramics, including alumina, aluminum nitride, silicon carbide, and zirconia substrates.
Applications:
Electronic Ceramic Substrates
Aluminum Nitride (AlN) and Alumina (Al₂O₃) DPC (Direct Plated Copper) substrates.
LED Packaging Ceramic Substrates
Metallization of high-thermal-conductivity AlN LED ceramic substrates; nickel-gold plating and copper conductive layers.
Industrial Ceramic Components
Electronic insulation ceramics and ceramic heat dissipation components; DLC coatings and anti-corrosion or conductive metal thin films.
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