There are two main categories: evaporation deposition coating and sputtering deposition coating, which include many types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, sol-gel method, etc.
1. For evaporation coating:
Generally, the target material is heated to evaporate the surface components in the form of atomic groups or ions.
Thickness uniformity mainly depends on:
1. The lattice matching degree between the substrate material and the target material
2. Substrate surface temperature
3. Evaporation power, rate
4. Vacuum degree
5. Coating time, thickness size.
Component uniformity:
The component uniformity of evaporation coating is not easy to guarantee. The specific factors that can be adjusted are the same as above. However, due to the limitation of the principle, for non-single component coating, the component uniformity of evaporation coating is not good.
Crystal orientation uniformity:
1. Lattice matching degree
2. Substrate temperature
3. Evaporation rate
Sputtering coating can be divided into many types. Generally speaking, the difference from evaporation coating is that the sputtering rate will become one of the main parameters.
In sputtering coating, laser sputtering coating pld is easy to maintain component uniformity, but the thickness uniformity at the atomic scale is relatively poor (because it is pulsed sputtering), and the control of crystal direction (outer edge) growth is also relatively general.
